Description:
Input Current Type:AC
Isolation Voltage:3750 V ac
Maximum Current Transfer Ratio:400%
Maximum Forward Voltage:1.4V
Maximum Input Current:50 mA
Mounting Type:Surface
Mount Number of Channels:1
Number of Pins:4
Output Device:Phototransistor
Package Type:Mini-Flat
Typical Fall Time:3µs
Typical Rise Time:4µs
Features
1.AC inputs.
2.High current transfer ratio.
2.Opaque type, mini-flat package.
3.Subminiature type (The volume is smaller than that of our conventional DIP type by as far as 30%).
4.Isolation voltage between input and output Viso:3750Vrms.
5.Employs double transfer mold technology.
6.Recognized by UL and CUL.
7.Packge : 1000Pcs / Reel.
8.RoHS Compliant.
Applications
1.Hybrid substrates that require high density mounting.
2.Programmable controllers.
